OSD6254-1G-IPM
  • image of System On Chip (SoC)> OSD6254-1G-IPM
OSD6254-1G-IPM
CLASSIFICATION
System On Chip (SoC)
manufacturer
Octavo Systems LLC
type
SYSTEM-IN-PACKAGE: TEXAS INSTRUM
encapsulation
package
Tray
RoHS
YES
price
available options
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specifications
PDF(1)
Operating Temperature
-40°C ~ 85°C
Part Status
Active
Grade
-
Qualification
-
Primary Attributes
-
Number of I/O
150
Flash Size
-
RAM Size
1GB
Architecture
MPU
Connectivity
CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB
Core Processor
ARM® Cortex®-A53, ARM® Cortex®-M4F
Peripherals
DDR, DMA, PWM
Package / Case
500-LFBGA
Supplier Device Package
500-LFBGA (9x14)
  • +86-755-82564498

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