OSDZU3EG1-2G-IFA
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OSDZU3EG1-2G-IFA
CLASSIFICATION
Microcontrollers, Microprocessor, FPGA Modules
manufacturer
Octavo Systems LLC
type
SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR
encapsulation
package
Tray
RoHS
YES
price
available options
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inventory:1600
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specifications
Operating Temperature
-40°C ~ 85°C
Part Status
Active
Module/Board Type
MPU Core
Flash Size
128MB
RAM Size
2GB
Speed
500MHz, 1.2GHz
Core Processor
ARM® Cortex®-R5F, ARM® Quad Cortex®-A53
Connector Type
600-BGA
Size / Dimension
1.570" L x 0.807" W (40.00mm x 20.50mm)